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Electronic Components News for electronics engineers & professionals involved in the electronics design & development industry. Latest electronic products & parts featured. - Bisinfotech
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News
Pickering reed relays achieve 88.5% lower thermal EMF
5+ day, 26+ min ago (274+ words) bisinfotech.com Pickering Electronics, a leading manufacturer of high-performance reed relays, has published new comparative test data showing that the companyâs compact reed relays produce substantially less thermal EMF than competing products This is important, especially in miniaturised low-voltage…...
Vishay introduces compact 16-bit inductive position sensor encoder
5+ day, 50+ min ago (342+ words) bisinfotech.com introduced a new medium-precision position sensor built on inductive technology for industrial applications Compared to solutions based on magnetic technology, the Vishay MCB RAIK045I MP absolute inductive kit encoder is immune to external magnetic fields, allowing it to be…...
Vishay Automotive Ferrite Common Mode Chokes Save Space and Boost Efficiency
2+ week, 5+ day ago (268+ words) Vishay Intertechnology, Inc. announced that it has expanded its portfolio of Automotive Grade common mode chokes with four new surface-mount devices designed to improve system efficiency while saving board space. Offered in compact case sizes, the Vishay Dale ICM5050-A, ICM6050-A,…...
Panasonic launches film capacitors for power electronics
3+ week, 4+ hour ago (277+ words) Bisinfotech Panasonic Industry Europe announces the release of its new ECWFJ series of metallized polypropylene film capacitors, developed to support cost-effective designs while maintaining a high level of safety and long-term reliability The new series is aimed at engineers working…...
Leo Hu to discuss advanced semiconductor packaging at PCIM
3+ week, 5+ hour ago (264+ words) Bisinfotech Indium Corporation Senior Area Technical Manager Leo Hu will discuss how key material innovations can collaboratively address cutting-edge advanced packaging process challenges at PCIM Asia 2026, August 26-28, in Shenzhen, China The presentation, titled Next-Gen Advanced Packaging Materials and System Integration…...
R&M rigorous testing standards for MPO fiber connectors.
3+ week, 6+ day ago (372+ words) Journalism and content professional with a strong passion for technology, innovation, and impactful storytelling. My work focuses on transforming complex technical developments into informative, engaging, and reader-friendly content that connects industry advancements with everyday understanding. With experience covering technology trends,…...